Explore our current and future assembly capabilities below. Our mission is to break down manufacturing barriers by offering Canada’s most accessible PCB assembly service—tailored specifically for your engineering prototypes, low-volume runs, and DIY passion projects.
Components
Current Capabilities
Our current capabilities are as follows:
- passif components of size 0603 and up
- pin pitch of 0.4mm and up
Future Capabilities
We are currently working towards capabilities for the following:
- passive components of size 0201 and up
- pin pitch of 0.2mm and up
- Bottom-Terminated Components and BGA
PCB
Current Capabilities
We currently have the capabilities to assemble rigid PCBs.
Future Capabilities
We are currently working to bring cost effective means of assembling flexible and flexi-rigid PCBs.
Processes
Current Capabilities
- Stencil fabrication
- Automated Pick-and-Place for Surface Mounted Devices.
- Customized reflow profiles
Future Capabilities
We are currently working our our documentation process to meet ROHS compliance.
We endevor future investments in our facilties to perform the following:
- Flying Probe Testing
- Conformal coating
- Serializing
- Depanelizing