We are Innostravo Technologies Inc. , doing business as Innostravo (“Company,” “we,” “us,” “our“).
These Legal Terms constitute a legally binding agreement made between you, whether personally or on behalf of an entity (“you“), and Innostravo Technologies Inc., concerning your documents shared with us.
Uploaded Electronic Engineering & Design Files
When you use our services to upload electronic project files—including but not limited to Gerber files, Bills of Materials (BOMs), ODB++ data, schematics, and mechanical drawings—we handle your data under strict confidentiality and technical safeguards.
Data Retention Period
All uploaded design and engineering files are securely stored on our systems for a maximum period of 90 days from the date of submission. This retention window allows us to process, fulfill, and support your specific project request. Upon the expiration of this 90-day period, the source files are permanently and irreversibly deleted from our active servers.
Intellectual Property and Copyright Protection
We explicitly recognize, respect, and protect your intellectual property (IP). You retain 100% ownership, copyright, and all other proprietary rights to all uploaded designs, circuitry layouts, and project files. We will never sell, share, replicate, or manufacture your proprietary designs for any third party without your express written consent.
Anonymized Technical Data Extraction
To optimize our engineering services, quoting engines, and internal machine-learning models, we extract specific, non-proprietary technical attributes from your files. During this automated extraction process, all identifying customer information, project names, and proprietary routing layouts are completely and permanently anonymized.
The only data points extracted and retained in our aggregate technical database include:
- Integrated Circuit (IC) & Component Specifications: Component part numbers, IC types, manufacturer packaging types, and associated footprint dimensions.
- Printed Circuit Board (PCB) Characteristics: Overall board dimensions, layer count, board thickness, substrate material topology, copper weights, and the quantity of devices populated on each side of the board.
This anonymized, aggregated data contains zero identifiable or traceable intellectual property and is utilized strictly for service improvement and manufacturing analytics.